View GL817E_4113089.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Genesys Logic, Inc.
GL817E
USB 2.0 MS/ MS PRO/ SD/ MMC Controller
Datasheet Revision 1.38 Apr. 19, 2006
GL817E USB2.0 MS/MS PRO/SD/MMC Controller
Copyright:
Copyright (c) 2006 Genesys Logic Incorporated. All rights reserved. No part of the materials may be reproduced in any form or by any means without prior written consent of Genesys Logic Inc..
Disclaimer:
ALL MATERIALS ARE PROVIDED "AS IS" WITHOUT EXPRESS OR IMPLIED WARRANTY OF ANY KIND. NO LICENSE OR RIGHT IS GRANTED UNDER ANY PATENT OR TRADEMARK OF GENESYS LOGIC INC.. GENESYS LOGIC HEREBY DISCLAIMS ALL WARRANTIES AND CONDITIONS IN REGARD TO MATERIALS, INCLUDING ALL WARRANTIES, IMPLIED OR EXPRESS, OF MERCHANTABILITY, FITNESS FOR ANY PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF INTELLECTUAL PROPERTY. IN NO EVENT SHALL GENESYS LOGIC BE LIABLE FOR ANY DAMAGES INCLUDING, WITHOUT LIMITATION, DAMAGES RESULTING FROM LOSS OF INFORMATION OR PROFITS. PLEASE BE ADVISED THAT THE MATERIALS MAY CONTAIN ERRORS OR OMMISIONS. GENESYS LOGIC MAY MAKE CHANGES TO THE MATERIALS OR TO THE PRODUCTS DESCRIBED THEREIN AT ANY TIME WITHOUT NOTICE.
Trademarks:
is a registered trademark of Genesys Logic, Inc. All trademarks are the properties of their respective owners.
Office:
Genesys Logic, Inc. 12F, No. 205, Sec. 3, Beishin Rd., Shindian City, Taipei, Taiwan Tel: (886-2) 8913-1888 Fax: (886-2) 6629-6168 http://www.genesyslogic.com
(c)2000-2006 Genesys Logic Inc. - All rights reserved.
Page 2
GL817E USB2.0 MS/MS PRO/SD/MMC Controller
Revision History
Revision 1.00 1.10 1.11 1.20 Date 09/25/2003 01/19/2004 04/14/2004 04/21/2004 First formal release. 1. Added LQFP-48 pin diagram, list and description. 2. Removed LQFP-64 pin diagram, list and description. 3. Added Chapter 8 Ordering Information. Updated package dimension. Removed NAND Flash interface 1. Added media memory card type in Chapter 1 And 2 2. Updated Table 6.1 - Absolute Maximum Ratings value 3. Updated Table 6.2 - DC Characteristics value 4. Added Chapter 6.3.5 Reset Timing 5. Updated IC Marking in package dimension diagram 1. Added USB2.0 certified Test ID in Chapter 2 Features 2. Changed Table 6.1 - Absolute Maximum Ratings 3. Added Table 6.2 - Operating Conditions Added Chapter 6.4.6 93C46 Timing Changed power pin description in Table 3.2 Changed pin# 13,14 pin description Update Datasheet to meet GL817E-09 with different pin out Add pin#11 pin description Modify pin#24 description to Power LED Add Reset timing chart Description
1.30
07/02/2004
1.31 1.32 1.33 1.34 1.35 1.36 1.38
01/18/2005 01/21/2005 02/01/2005 03/06/2005 04/06/2005 06/21/2005 04/19/2006
(c)2000-2006 Genesys Logic Inc. - All rights reserved.
Page 3
GL817E USB2.0 MS/MS PRO/SD/MMC Controller
TABLE OF CONTENTS CHAPTER 1 CHAPTER 2 CHAPTER 3 GENERAL DESCRIPTION................................................. 6 FEATURES ........................................................................... 7 PIN ASSIGNMENT .............................................................. 8
3.1 PINOUTS .................................................................................................. 8 3.2 PIN LIST .................................................................................................. 9 3.3 PIN DESCRIPTIONS .................................................................................. 9 CHAPTER 4 CHAPTER 5 BLOCK DIAGRAM............................................................ 12 FUNCTION DESCRIPTION ............................................. 13
5.1 UTM ..................................................................................................... 13 5.2 SIE ........................................................................................................ 13 5.3 EP0 FIFO ............................................................................................. 13 5.4 BULK FIFO ........................................................................................... 13 5.4.1 TXFIFO ........................................................................................ 13 5.4.2 RXFIFO ........................................................................................ 13 5.5 MHE (MEDIA INTERFACE) ................................................................... 13 5.6 USB REGISTERS / FIFO CONTROL ....................................................... 13 CHAPTER 6 ELECTRICAL CHARACTERISTICS.............................. 14 6.1 ABSOLUTE MAXIMUM RATINGS............................................................ 14 6.2 OPERATING CONDITIONS ...................................................................... 14 6.3 DC CHARACTERISTICS.......................................................................... 14 6.4 AC CHARACTERISTICS.......................................................................... 15 6.4.1 UTMI Transceiver........................................................................ 15 6.4.2 Secure Digital / MultiMediaCard ................................................ 15 6.4. 3 Memory Stick .............................................................................. 15 6.4. 4 Memory Stick Pro ....................................................................... 15 6.4.5 Reset Timing ................................................................................. 16 6.4.6 93C46 Timing ............................................................................... 16 CHAPTER 7 PACKAGE DIMENSION...................................................... 18 CHAPTER 8 ORDERING INFORMATION........................................... 19
Page 4
(c)2000-2006 Genesys Logic Inc. - All rights reserved.
GL817E USB2.0 MS/MS PRO/SD/MMC Controller
LIST OF FIGURES
FIGURE 3.1 - 48 PIN LQFP PINOUT DIAGRAM .................................................................8 FIGURE 4.1 - BLOCK DIAGRAM ......................................................................................12 FIGURE 6.2 - TIMING DIAGRAM OF SD / MMC INTERFACE ...........................................15 FIGURE 6.3 - TIMING DIAGRAM OF MEMORYSTICK ......................................................15 FIGURE 6.4 - TIMING DIAGRAM OF MEMORYSTICK PRO...............................................15 FIGURE 6.5 - TIMING DIAGRAM OF RESET WIDTH .........................................................16 FIGURE 6.6 - TIMING DIAGRAM OF 93C46 .....................................................................17 FIGURE 7.1 - GL817E 48 PIN LQFP PACKAGE..............................................................18
LIST OF TABLES
TABLE 3.1 - 48 PIN LIST ...................................................................................................9 TABLE 3.2 - 48 PIN DESCRIPTIONS ...................................................................................9 TABLE 6.1 - ABSOLUTE MAXIMUM RATINGS .................................................................14 TABLE 6.2 - OPERATING CONDITIONS............................................................................14 TABLE 6.3 - DC CHARACTERISTICS ...............................................................................14 TABLE 8.1 - ORDERING INFORMATION...........................................................................19
(c)2000-2006 Genesys Logic Inc. - All rights reserved.
Page 5
GL817E USB2.0 MS/MS PRO/SD/MMC Controller
CHAPTER 1
GENERAL DESCRIPTION
The GL817E is a highly compatible, best performance USB 2.0 Flash Card Reader Controller. It supports TM TM USB 2.0 high-speed transmission to Secure Digital (SD), Mini SDTM, MultiMediaCard (MMC), RS TM TM TM MultiMediaCard (RS MMC), Memory Stick (MS), Memory Stick Duo (MS Duo), High Speed TM Memory StickTM (HS MS), Memory Stick Pro (MS Pro), Memory Stick ProTM Duo (MS Pro Duo) Memory Stick ROM interface on one chip. The GL817E integrates Genesys Logic own design USB 2.0 high-speed UTMI (USB 2.0 Transceiver Macrocell Interface) transceiver, the Serial Interface Engine (SIE), and compatible 8-bit micro-controller. By complies with Universal Serial Bus specification rev. 2.0 and USB Storage Class specification ver.1.0, the GL817E can be supported by Windows XP/ 2000/ Me default driver. Also it is supported in Windows 98/ 98SE, Mac, and Linux operating system. For the power consumption consideration, the GL817E complies with USB power specification for bus-powered devices. The GL817E is available in 48-pin LQFP (Internal Mask ROM code), and it is the best cost / performance solution for your USB 2.0 high-speed Flash Card Reader application.
(c)2000-2006 Genesys Logic Inc. - All rights reserved.
Page 6
GL817E USB2.0 MS/MS PRO/SD/MMC Controller
CHAPTER 2 * * * * * * * * * *
l
FEATURES
TM TM
Supports USB 2.0 to Memory Stick (MS) and Memory Stick PRO TM and MultiMediaCard (MMC) interface on one chip.
(MS PRO), Secure Digital
TM
(SD)
Supports all combinations of MS/ MS PRO/ SD/ MMC application design. Complies with 480Mbps Universal Serial Bus specification rev. 2.0.vc Complies with USB Storage Class specification rev. 1.0. (Bulk only protocol). USB 2.0 certified (Test ID=40390390) Operating System supported: Windows XP/ 2000/ Me/ 98/ 98SE, Mac OS 9.x/ X, Linux. Supports customized storage device icon under Windows 98/ 98SE/ 2000 (SP2, SP3 and SP4) by Genesys Logic own driver.
Integrated USB 2.0 Transceiver Macrocell Interface (UTMI) transceiver and Serial Interface Engine (SIE).
Integrated MCU compatible 8-bit micro-controller. Hardware ECC generation and verification. Memory StickTM (MS) / Memory Stick DuoTM (MS Duo) / High Speed Memory StickTM (HS MS) / TM Memory Stick Pro (MS Pro) / Memory Stick ProTM Duo (MS Pro Duo) Memory Stick ROM interface - Complies with Memory Stick Standard Memory Stick PRO Format Specifications ver 1.00-01 - Complies with Memory Stick Format Specifications ver 1.40-00 - Hardware support 4-bit HS Memory Stick PRO interface - Supports INS signal - Supports automatic CRC16 generation and verification - Supports different clock rate up to 40 MHz Secure DigitalTM , Mini SDTM and MultiMediaCardTM - Complies with Secure DigitalTM / MultiMediaCardTM interface specification - Supports both SD / MMC mode access CLK/CMD/DAT0/DAT1/DAT2/DAT3 - Command transmit and response receive can be enabled separately - Automatic CRC7 generation for command and CRC7 verification for response on CMD - Support automatic CRC16 generation and verification on DAT3-0
In addition to full packet transaction, optional single byte / bit operation on both CMD and DAT line / lines
l
-
Data processing in block or byte Supports different clock rate from 375 KHz to 24 MHz
*
High efficient hardware engine - Automatic data read / write with card by hardware engine. - Easier firmware development. - Media interface signals output low automatically when suspend. - Supports automatic CRC16 generation and verification. Supports firmware correct page ECC error capability. Supports automatic page copy (source page read + destination page write). Complies with USB power specification for bus-powered devices. Supports Suspend and Wake-up Resume. 3.3 Volt operation. Available in 48-pin LQFP package.
* * * * * *
(c)2000-2006 Genesys Logic Inc. - All rights reserved.
Page 7
GL817E USB2.0 MS/MS PRO/SD/MMC Controller
CHAPTER 3
3.1 Pinouts
PIN ASSIGNMENT
93C46_DO
EXTRSTZ
93C46_DI
DGND2
DVDD2
MS_D1
MS_D0
MS_D2
MS_D3
SD_D0
36
35
34
33
32
31
30
29
28
27
26
MS_INS MS_BS SDPCTL/GPIO9
MSPCTL/GPIO10
37 38 39 40 41 42 43 44 45 46 47 48
25
SD_D1
GPIO2
24 23 22 21 20 19
MVMCSZ SD_WPZ SD_CDZ DGND1 DVCC1 MS_CLK GPIO3 UDVSS1 UDVCC1 UGND2 XO XI
SD_CLK SD_CMD SD_D3 SD_D2 DVCC3 DGND3 93C46_SK 93C46_CS
GL817E
LQFP - 48
18 17 16 15 14 13
10
11 RREF
DGND0
UDGND0
AVDD1
AGND1
UDVCC1/NC
RPU/NC
VPF/NC
VMF/NC
Figure 3.1 - 48 Pin LQFP Pinout Diagram
(c)2000-2006 Genesys Logic Inc. - All rights reserved.
AVDD2
VPH
VMH
12
1
2
3
4
5
6
7
8
9
Page 8
GL817E USB2.0 MS/MS PRO/SD/MMC Controller 3.2 Pin List
Table 3.1 - 48 Pin List
Pin# 1 2 3 4 5 6 7 8 9 Pin Name Type Pin# DGND0 UDVCC1/ NC UDGND0 RPU/ NC AVDD1 VPF/ NC VPH VMF/ NC VMH P P P A P A A A A P A P Pin Name Type Pin# I O P P P Pin Name Type Pin# Pin Name Type B/I O B/O B/O O
B/SO
13 XI 14 XO 15 UGND2 16 UDVCC1 17 UDVSS1 18 GPIO3 19 MS_CLK 20 DVCC1 21 DGND1 22 SD_CDZ 23 SD_WPZ 24 NVMCSZ
25 SD_D1 26 GPIO2 27 SD_D0 28 93C46_DO 29 93C46_DI
B/SO 37 MS_INS
B/O 38 MS_BS
B/SO 39
SDPCTL/ GPIO9 MSPCTL/ B/I 40 GPIO10 B/O 41 SD_CLK I 42 SD_CMD
B/O 30 EXTRSTZ O P P B/I B/I O 31 MS_D3 32 DVDD2 33 MS_D2 34 MS_D0 35 DGND2 36 MS_D1
B/SO 43 SD_D3
B B P P B/O B/O
P
44 SD_D2
B/SO 45 DVCC3 B/SO 46 DGND3
10 AGND1 11 RREF 12 AVDD2
P
47 93C46_SK
B/SO 48 93C46_CS
3.3 Pin Descriptions
Table 3.2 - 48 Pin Descriptions
Pin Name DGND0~3 Pin# 1,21,35,46 Type P Digital GND #0~3 GL817E-07: UDVCC1 2 P UTMI Digital VDD #1. GL817E-08/GL817E-09: NC: No connection. UDVCC1 UGND0 16 3 P P UTMI Digital VDD #1 UTMI GND #0 GL817E-07: RPU/ NC 4 A USB resistor pulls up when GL817E-07 mounted. GL817E-08 ~ High: NC: No connection. AVDD1 VPF 5,12 6 P A Analog VDD #1 GL817E-07: FS D+ Description
(c)2000-2006 Genesys Logic Inc. - All rights reserved.
Page 9
GL817E USB2.0 MS/MS PRO/SD/MMC Controller
GL817E-08/GL817E-09: NC: No connection. VPH 7 A HS D+ GL817E-07: VMF 8 FS DA GL817E-08/GL817E-09: NC: No connection. VMH AGND1 RREF XI 9 10 11 13 A P A I HS DAnalog GND #1 Reference resistor 12MHz Crystal This pin can be connected to one terminal of the crystal or can be connected to an external 12MHz clock when a crystal is not used. 12MHz Crystal This is the other terminal of the crystal, or left open when an external clock source is used to drive XTAL/CLK. It may not be used to drive any external circuitry other than the crystal circuit. UTMI GND
XO
14
O
UGND2 UDVSS1
15 17
P
GPIO2~3,9,10 26,18,39,40 MS_CLK DVCC1,3 SD_CDZ SD_WPZ NVMCSZ SD_D0~3 93C46_DO 93C46_DI EXTRSTZ MS_D0~3 DVDD2 MS_INS MS_BS SD_PCTL MS_PCTL 19 20,45 22 23 24 27,25,44,43 28 29 30 34,36,33,31 32 37 38 39 40
P UTMI Digital GND B/O GPIO2~3,9,10 (odpu) O P B/I (pu) B/I (pu) O (pu) B/SO (pu) B/I B/O I (pu) B/SO (pu) P B/I (pu) O B/O B/O Memory Stick SCLK Digital VDD #1,3 SD CD# SD Write Protect Detect Power LED SD DAT0~3 93C46 Data out 93C46 Data in External reset Internal pull-up : 65K ohm (+/- 50% ) MS DAT3~0 Digital VDD #2 Memory Stick INS Memory Stick BS SD power control MS power control Page 10
(c)2000-2006 Genesys Logic Inc. - All rights reserved.
GL817E USB2.0 MS/MS PRO/SD/MMC Controller
SD_CLK SD_CMD 93C46_SK 93C46_CS Notation: Type O I B B/I B/O P A SO pu pd odpu 41 42 47 48 O B/SO (pu) B/O B/O SD/MMC CLK SD/MMC CMD 93C46 Clock 93C46 CS
Output Input Bi-directional Bi-directional, default input Bi-directional, default output Power / Ground Analog Automatic output low when suspend Internal pull up Internal pull down Open drain with internal pull up
(c)2000-2006 Genesys Logic Inc. - All rights reserved.
Page 11
GL817E USB2.0 MS/MS PRO/SD/MMC Controller
CHAPTER 4
BLOCK DIAGRAM
TXFIFO DATA A UTM SIE RXFIFO DATA A DATA B DATA B
EP0FIFO
RXFIFO TXFIFO
MHE USB Register + FIFO Control
SD/ MMC MS/ MS PRO
SRAM MCU ROM
Figure 4.1 - Block Diagram
(c)2000-2006 Genesys Logic Inc. - All rights reserved.
Page 12
GL817E USB2.0 MS/MS PRO/SD/MMC Controller
CHAPTER 5
5.1 UTM
FUNCTION DESCRIPTION
The USB 2.0 Transceiver Macrocell, it's the analog circuitry that handles the low level USB protocol and signaling, and shifts the clock domain of the data from the USB 2.0 rate to one that is compatible with the general logic.
5.2 SIE
The Serial Interface Engine, which contains the USB PID and address recognition logic, and other sequencing and state machine logic to handle USB packets and transactions.
5.3 EP0 FIFO
Endpoint 0 FIFO: The Control FIFO. It is composed of TX0FIFO and RX0FIFO, with 64-byte FIFO each, and it is used for endpoint 0 data transfer.
5.4 Bulk FIFO
It is composed of TXFIFO and RXFIFO for data transmission and receiving respectively, also with different modes support:
5.4.1 TXFIFO
To ensure the continuous data transmission, TXFIFO includes 512 bytes DATA-A FIFO, 512 bytes DATA-B FIFO, and two 16 bytes corresponding redundant areas. All can be directly accessed by MCU. Normally SIE popes data, SME pushes data for DATA A/B FIFOs, and redundant area is pushed by SME and popped by MCU. Supports MCU single byte access for SmartMedia ECC error correction. Supports transmit mode SIE won't transmit data filled in TXFIFO before MCU complete the data integrity checking.
-
5.4.2 RXFIFO
To ensure the continuous data transmission, RXFIFO includes 512 bytes DATA-A FIFO, 512 bytes DATA-B FIFO, and 16 bytes single redundant area. All can be directly accessed by MCU. Normally SME popes data, SIE pushes data for DATA A/B FIFOs, and redundant area is pushed by MCU and popped by SME.
5.5 MHE (Media Interface)
SD/MMC Engine. MS/MS PRO Engine.
5.6 USB Registers / FIFO Control
It is a register space to store status information and to control the functions of GL817E by MCU.
(c)2000-2006 Genesys Logic Inc. - All rights reserved.
Page 13
GL817E USB2.0 MS/MS PRO/SD/MMC Controller
CHAPTER 6
ELECTRICAL CHARACTERISTICS
6.1 Absolute Maximum Ratings
Table 6.1 - Absolute Maximum Ratings
Parameter Storage Temperature Ambient Temperature Supply Voltage to Ground Potential DC Input Voltage to Any Pin Value -65C to +150 C -40C to +80 C -0.5V to +4.0V -0.5V to +5.8V
6.2 Operating Conditions
Table 6.2 - Operating Conditions
Parameter Ta (Ambient Temperature Under Bias) Supply Voltage Ground Voltage FOSC (Oscillator or Crystal Frequency) Value 0C to 70C +3.0V to +3.6V 0V 12 MHz 0.25%
6.3 DC Characteristics
Table 6.3 - DC Characteristics
Symbol VCC VIH VIL II VOH VOL IOH IOL CIN ISUSP ICC Parameter Supply Voltage Input High Voltage Input Low Voltage Input Leakage current Output High Voltage Output Low Voltage Output Current High Output Current Low Input Pin Capacitance Suspend current Supply current 1.5K external pull-up included Connect to USB with MCU operating 0 < VIN < VCC Condition Min. 3.0 2.6 0.0 -10 3.0 Typ. 3.3 8.3 7.8 Max. 3.6 5 0.7 10 0.2 2.0 280 85 Unit V V V A V V mA mA pF A mA
(c)2000-2006 Genesys Logic Inc. - All rights reserved.
Page 14
GL817E USB2.0 MS/MS PRO/SD/MMC Controller 6.4 AC Characteristics 6.4.1 UTMI Transceiver
The GL817E is fully compatible with Universal Serial Bus specification rev. 2.0 and USB 2.0 Transceiver Macercell Interface (UTMI) specification rev. 1.01. Please refer to the specifications for more information.
6.4.2 Secure Digital / MultiMediaCard
CMD CLK DAT
dddxdxdxdddddddddddddddddxdddd rfrfrfrfrfrfrfrfrfrfrfrfrfrfrf dddddddddddddxdddddddddddxdddd
Figure 6.2 - Timing Diagram of SD / MMC Interface
Parameter
Description
Mode 0 1 2 3
Typ 375K 6M 15M 24M
Unit
Remark
Fck
CLK frequency
Hz
6.4. 3 Memory Stick
BS SCLK SDIO
llrhhhhhhhhhhhhhhhfllllllllll lllrfrfrfrfrfrfrfrfrfrfrfrfrf ddddxdddddddddddddddxdddddddd
Figure 6.3 - Timing Diagram of MemoryStick
Parameter
Description
Mode 0
Typ 1.5M 6M 15M 24M
Unit
Remark
Fck
SCLK frequency
1 2 3
Hz
6.4. 4 Memory Stick Pro
BS SCLK DATA
llrhhhhhhhhhhhhhhhfllllllllll lllrfrfrfrfrfrfrfrfrfrfrfrfrf dddxdxdxdxdxdxdxdxdxdxdxdxdxd
Figure 6.4 - Timing Diagram of MemoryStick Pro
Parameter Fck
Description SCLK frequency
Mode 0 1
Typ 30M 40M
Unit Hz
Remark
(c)2000-2006 Genesys Logic Inc. - All rights reserved.
Page 15
GL817E USB2.0 MS/MS PRO/SD/MMC Controller 6.4.5 Reset Timing
Trst
Extrstz
Figure 6.5 - Timing Diagram of Reset width
Figure 6.6- Timing Diagram of Power Good to USB command receive ready
Parameter Trst T1 T2 Description Chip reset sense timing width External reset valid from power up to high Reset Deassertion to respond USB command ready Min 2 1.03 72 Typ Max Unit us ms ms
6.4.6 93C46 Timing \\;\\@'\\\\\\\\\\\\\\\\\;\@;\\@' llrhhhhhhhhhhhhhhhhhhhhhhhhflllr Tskh Tskl \\\\\\;\\\\@;\\\\@'\\\\\\\\\\\\\ llllllahhhhhblllllahhhhhflllllll Tdis Tdih \\\;z@;z@'\\\\\\\\\\\\\\\\\\\\\\ dddxdddddxdddddxdddddxdddddddddd Tpd0 Tpd1 \\\\\\;@'\\\\\\\\\;@'\\\\\\\\\\\ hhhhhhhhflllllllllllrhhhhhh^zzzz Tdf Tsv \\;\\@'\\\\\\\\\\\\\\\\\\\\;@'\\ STATUS VALID zzzzzznddddddddddddddddddddddozz
Page 16 Tcss Tcsh Tcs
CS SK DI DO READ DO
PROGRAM (c)2000-2006 Genesys Logic Inc. - All rights reserved.
GL817E USB2.0 MS/MS PRO/SD/MMC Controller
Figure 6.6 - Timing Diagram of 93C46
Parameter Tskh Tskl Tcs Tcss Tdis Tcsh Tdih Tpd1 Tpd0 Tsv Tdf Description SK High Time SK Low Time Minimum CS Low Time CS Setup Time DI Setup Time CS Hold Time DI Hold Time Output Delay to "1" Output Delay to "0" CS to Status Valid CS to DO in High Impedance Min 250 250 250 50 100 0 100 Typ Max 250 250 250 100 ns Unit
(c)2000-2006 Genesys Logic Inc. - All rights reserved.
Page 17
GL817E USB2.0 MS/MS PRO/SD/MMC Controller
CHAPTER 7 PACKAGE DIMENSION
D D1 D2 D A A2 A1
36 37
25 24
A E1 E2 E
Internal No.
GL817E AAAAAAAGAA YWWXXXXXXXX
Date Code Lot Code
Green Package
B
Code No.
48 1
e b 4X
13 12 4X
bbb H A B D L1 c aaa C A B D
01 0
ddd M C A B s D s
C ccc C
SEATING PLANE
02 R1 H R2
0.25mm
GAGE PLANE
S
L
03 -
NOTES : 1. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 mm PER SIDE. D1 AND E1 ARE MAXIMUM PLASTIC BODY SIZE DIMENSIONS INCLUDING MOLD MISMATCH. 2. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED THE MAXIMUM b DIMENSION BY MORE THAN 0.08mm. DAMBAR CAN NOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSION AND AN ADJACENT LEAD IS 0.07mm.
CONTROL DIMENSIONS ARE IN MILLIMETERS. MILLIMETER INCH SYMBOL MIN. NOM. MAX. MIN. NOM. MAX. A 1.60 0.063 A1 0.05 0.15 0.002 0.006 1.35 A2 1.40 1.45 0.053 0.055 0.057 D 9.00 BASIC 0.354 BASIC E 9.00 BASIC 0.354 BASIC D1 7.00 BASIC 0.276 BASIC E1 7.00 BASIC 0.276 BASIC D2 5.50 BASIC 0.217 BASIC E2 5.50 BASIC 0.217 BASIC R1 0.08 0.003 R2 0.08 0.20 0.003 0.008 0 0 3.5 7 0 3.5 7 01 0 0 02 11 12 13 11 12 13 03 11 12 13 11 12 13 c 0.09 0.20 0.004 0.008 L 0.45 0.60 0.75 0.018 0.024 0.030 L1 1.00 REF 0.039 REF S 0.20 0.008 b 0.17 0.20 0.27 0.007 0.008 0.011 e 0.50 BASIC 0.020 BASIC TOLERANCES OF FORM AND POSITION aaa 0.20 0.008 bbb 0.20 0.008 ccc 0.08 0.003 ddd 0.08 0.003
Figure 7.1 - GL817E 48 Pin LQFP Package
(c)2000-2006 Genesys Logic Inc. - All rights reserved.
0.05 S
Page 18
GL817E USB2.0 MS/MS PRO/SD/MMC Controller
CHAPTER 8
ORDERING INFORMATION
Table 8.1 - Ordering Information
Part Number GL817E
Package 48-pin LQFP
Status
(c)2000-2006 Genesys Logic Inc. - All rights reserved.
Page 19

▲Up To Search▲

Price & Availability of GL817E

	To Download GL817E Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .